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Semiconductor Devices & Manufacturing
Dennis
Buss Dr. Dennis D. Buss, Ph.D., Vice President, Si Technology Development, Texas Instruments Incorporated. Dr. Buss is Vice President of Silicon Technology Development at Texas Instruments Incorporated with responsibility for Technology Computer Aided Design (TCAD) and is the chairman of TI’s Technical Ladder Policy Board (TLPB). Dennis began his industrial career at Texas Instruments in July 1969. During the next 18 years, Dennis was TI Fellow and later Vice President and Director of TI's Semiconductor Process and Design Center. Between 1987 and 1997, Dennis was Vice President of Technology at Analog Devices. He returned to Texas Instruments in December 1997. Dennis received his BS, MS and Ph.D. in Electrical Engineering from MIT in 1963, 1965 and 1968. He served twice on the Electrical Engineering faculty at MIT in 1968-1969 and 1974-1975. He is an IEEE Fellow and the recipient of the 1985 Herschel Award and the 1987 Jack A. Morton Award for his pioneering work on HgCdTe Infra-Red monolithic focal plane technology. In February 2000, Dennis was selected by the Electron Devices Society to be one of the recipients of an IEEE Third Millennium Medal. Jean-Pierre Colinge, Ph.D.,
Professor of Electrical Engineering, University of California,
Davis. From 1981 to 1984 he was Researcher at the Centre National d'Etudes des Télécommunications (CNET), Grenoble, France, where he developed early for the fabrication of SOI films and developed the "Stacked CMOS" technique (one of the first 3D structures). From 1985 to 1988 he was member technical staff of the Hewlett-Packard Research Labs, Palo Alto, CA, where he carried out research and development work on thin-film SOI devices and discovered many of the properties of fully depleted SOI devices (sharp subthreshold slope, absence of kink effect, properties of transconductance, etc.) From 1988 to 1991 he was project leader for the SOI research at IMEC (Inter University Microelectronics Center) in Leuven, Belgium. He designed and fabricated novel SOI devices, including radiation-hard devices and the first double-gate SOI transistors. From 1991 to 1997 he was Professor at the Université Catholique de Louvain, heading research in the areas of SOI device physics and technology, high-temperature SOI integrated circuits, radiation-hard integrated SOI circuits, quantum effects (2D,1D) in SOI devices, microwave SOI devices, and low-power SOI circuits. He is currently carrying research in advances multiple-gate SOI MOSFET device physics. He has been on the committee of several conferences, including IEDM and SSDM, has been General Chairman of the IEEE SOS/SOI Technology Conference in 1988, and is a Fellow of IEEE. He has published over 250 scientific papers and three books on the field of SOI as well as two books on semiconductor device physics and four book chapters on SOI. Dr. Colinge has given lectures on SOI at short courses offered by various conferences, including IEDM, NSREC and the IEEE International SOI Conference. < David Goldhaber-Gordon, Ph.D.,
Assistant Professor, Physics, Stanford University. Over the last decade, mesoscopic physics has forced us to grapple with new ways of thinking about quantum mechanics, especially for systems of interacting particles. Current CMOS transistors are now in this same size range, so some of the same considerations are becoming important in device design. Prof. Goldhaber-Gordon maintains an active interest in nanoelectronic computing, and wrote a seminal paper on the subject in 1997. He is the recipient of a 1998 Award for Best Paper by a Young Author at the International Conference on Physics of Semiconductors, as well as the 2002 George E. Valley Prize of the American Physical Society, the 2002 MacMillan Award of the University of Illinois, and a 2003 Sloan Fellowship. David Harame, Ph.D., Director
Semiconductor Technologies Enablement, IBM. Dr. Harame now lives in Essex Junction Vermont where he directs IBM’s Microelectronic Division Enablement Area. This area develops both RF/Analog and Digital models and design kits for SOI, CMOS, and SiGe BiCMOS Technologies. David is a Distinguished Engineer of the IBM Corporation. David is the Technical Program Chair for the 2004 IEEE Bipolar BiCMOS Circuits and Technology Meeting. He is also the Lead Symposium Organizer for the 2004 ECS SiGe: Materials, Processes, and Devices Symposium. He has authored or co-authored over 154 articles and holds 16 patents. He is an IEEE Fellow. Paul A. Kohl, Ph.D., Professor, Department of Chemical Engineering, Georgia Institute of Technology. In 1989, he joined the faculty of the Georgia Institute of Technology, where he is currently a Regents’ Professor. His research interests include ultra low-k dielectric materials, interconnects for microelectronic devices, electronic packaging, and electrochemical energy conversion devices (batteries and fuel cells). He is Editor of the Journal of The Electrochemical Society. He received the Carl Wagner Award from the ECS in 2001. He has over 130 journal publications, and 30 patents. Yoshio Nishi, Ph.D., Professor
(Research) of Electrical Engineering, Director of Stanford Nanofabrication
Facility, Stanford University. In 1986 he joined Hewlett-Packard Laboratories as Director of the Silicon Process Laboratory where he built HP's first converged CMOS technology at 0.8 micron geometry used in HP Risc Processor, PA-RISC chip sets. In 1994, he established and became Director of the ULSI Research Laboratory. Dr. Nishi joined Texas Instruments Incorporated in 1995 as Vice President and Director of Research and Development for the Semiconductor Group. In 1996, he was elected Senior Vice President, responsible for R&D activities for digital signal processing solutions, semiconductor processes and devices, memory, as well as components and materials. Dr. Nishi has published over 125 papers in international technical journals and conferences, and has co-authored nine books. He has been awarded more than 50 patents in the U.S. and Japan. He is a Fellow of the IEEE; a member of the Japan Society of Applied Physics; Institute of Electronics, Communication Engineers of Japan; and the Electrochemical Society. He received the IECE Japan Award in 1972, IR100 awards in 1982 and 1986 for nonvolatile memory productization. In 1995, he received the IEEE Jack A. Morton Award. He is also the 2002 Robert Noyce Medal recipient. R. Fabian W. Pease, Ph.D., William Ayer Professor of Electrical Engineering, Stanford University. Dr. Pease served as a radar officer in the Royal Air Force from 1955 to 1957, and received his B.A., M.A., and Ph.D. degrees from Cambridge University in 1960, 1962, and 1964, respectively. His Ph.D. thesis was on High Resolution Scanning Electron Microscopy. After graduating, he was an Assistant Professor of Electrical Engineering at UC Berkeley for three years, where he continued his microscopy research. In 1967, Dr. Pease joined the technical staff of Bell Laboratories, where he first worked on digital television and later led a group that developed the processes for electron beam lithographic mask manufacture, and demonstrated a pioneering LSI circuit built with electron beam lithography. Since 1978 he has been a Professor of Electrical Engineering at Stanford University. On sabbatical in 1993 and 1994, Dr. Pease conducted research on the synthesis of DNA microarrays at Affymetrix Corporation. From 1996 to 1998, he was assigned to the Defense Advanced Research Projects Agency, where he initiated programs in Advanced Microelectronics and in Molecular-Level Printing. Dr. Pease was appointed the William E. Ayer Professor of Electrical Engineering in March 2001. He is a Fellow of the IEEE, and has served the IEEE in a variety of capacities. He is also a member of the National Academy of Engineering. He has published over 200 articles and authored several book chapters. T.J. Rodgers is founder,
president, CEO, and a director of Cypress Rodgers was a Sloan scholar at Dartmouth College, where he graduated
as Rodgers has been cited for his achievements in supporting the
philosophy of Krishna Saraswat, Ph.D.,
Rickey/Nielsen Professor of Engineering, Stanford University. During 1969-70, he worked on microwave transistors at Texas Instruments. Returning to Stanford in 1971, he did his Ph.D. on high voltage MOS devices and circuits. After graduating he joined Stanford University as a Research Associate in 1975 and later became a Professor of Electrical Engineering in 1983. For the next 15 years, Prof. Saraswat worked on modeling of CVD of silicon, conduction in polysilicon, diffusion in silicides, contact resistance, interconnect delay and 2-D oxidation effects in silicon. He pioneered the technologies for aluminum/titanium layered interconnects, CVD of tungsten silicide MOS gates, CVD tungsten MOS gates and tunable workfunction SiGe MOS gates. During the late 80’s he became interested in the economics and technology of single wafer manufacturing. He developed equipment and simulators for single wafer thermal processing, deposition and etching and technology for the in-situ measurements and real-time control. Jointly with Texas Instruments a microfactory for single wafer manufacturing was demonstrated in 1993. Since the mid 90’s Prof. Saraswat has been working on new materials, devices and interconnects for scaling MOS technology to nm range. He has pioneered several new concepts of 3-D ICs with multiple layers of heterogeneous devices. His group has recently demonstrated the first high performance germanium MOSFETs with high-k dielectrics. Since 2000 he has also been doing research on Environmentally Benign Semiconductor Manufacturing and is currently Associate Director of the NSF/SRC Engineering Research Center for it. Prof. Saraswat has authored or co-authored over 400 technical papers, of which six have received Best Paper Award. He is a Fellow of the IEEE, and a member of both The Electrochemical Society and The Materials Research Society. He received the Thomas Callinan Award from The Electrochemical Society in 2000 for his contributions to the dielectric science and technology. He is the recipient of the 2004 IEEE Andrew Grove Award for seminal contributions to silicon process technology. He received two gold medals for academic excellence during his education in India. Robert Socha, Imaging Scientist, Technology Development Center, ASML. Dr. Socha received his B.S. degree in electrical engineering from University of Michigan in 1991 and his Ph.D. degree in electrical engineering from the University of California at Berkeley in 1997. At the University of California at Berkeley, his studies concentrated on optical lithography under the direction of Prof. Andrew Neureuther. In 1997, he joined National Semiconductor and worked on optical lithography resolution enhancement techniques such as optical proximity correction (OPC) and phase shift mask (PSM). In 1999 he joined ASML where he works with customers to help them use ASML lithography equipment more effectively. Dr. Socha uses various resolution enhancement techinques to achieve the smaller resolution. These resolution enhancement techniques include mask OPC, phase shift mask, off axis illumination, and mask-illumination optimization. In addition to helping customers with resolution enhancement techniques, Dr. Socha also uses his background in modeling and coding to produce resolution enhancement software with ASML Masktools. Dr. Socha has published 25 papers in international technical journals and conferences, and is currently working on a book for mask resolution enhancement techniques. He has been awarded 5 patents internationally. He is a member of SPIE and a member of the IEEE. In 1992 he was awarded a National Science Foundation Graduate Fellowship and in 1996 he was awared a Semiconductor Research Corporation Graduate Fellowship. |
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